Interface diffusion and morphology of aerospace grade epoxy co-cured with thermoplastic polymers

Interfaces formed during the co-curing of an aerospace grade epoxy resin in contact with PEI, PES, and PSU surfaces are examined in this work. The interface found in each scenario is characterized by optical microscopy, and low voltage Scanning Electron Microscopy (SEM) using Energy-Dispersive X-ray spectroscopy (EDX) where applicable. Atomic Force Microscopy (AFM) in tapping mode is also used for high resolution imaging of the interface. The...