Torsional stress relaxation behavior of microscale copper wire

Volume: 698, Pages: 277 - 281
Published: Jun 1, 2017
Abstract
Torsional stress relaxation behavior of copper wire with a diameter of 50 µm and grain size of 3.7 µm is experimentally investigated at room temperature. It is revealed that the stress relaxation occurs in both elastic and plastic regions. An elevated stress drop and a reduced apparent activation volume with increasing initial stress levels are also found in both elastic and plastic regions. Extremums of stress drop and activation volume are...
Paper Details
Title
Torsional stress relaxation behavior of microscale copper wire
Published Date
Jun 1, 2017
Volume
698
Pages
277 - 281
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