Chemical Deposition and Stabilization of Plasmonic Copper Nanoparticle Films on Transparent Substrates

Volume: 24, Issue: 13, Pages: 2501 - 2508
Published: Jun 18, 2012
Abstract
Preparation of supported copper nanostructures has been scarce, compared to the more noble metals Ag and Au, mainly due to the lower stability of Cu toward corrosion in aqueous solutions and oxidation in air, either during or after preparation. Still, as a markedly inexpensive metal, Cu might present an attractive substance, if suitable Cu nanoparticle (NP) deposition and stabilization methods could be developed. Here, we present the first case...
Paper Details
Title
Chemical Deposition and Stabilization of Plasmonic Copper Nanoparticle Films on Transparent Substrates
Published Date
Jun 18, 2012
Volume
24
Issue
13
Pages
2501 - 2508
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