The use of electromechanical impedance conductance signatures for detection of weak adhesive bonds of carbon fibre–reinforced polymer

Volume: 14, Issue: 4, Pages: 332 - 344
Published: May 22, 2015
Abstract
The joints between structural elements should ensure safe usage of the structure. One of the joining method is based on adhesive bonding. However, adhesive bonding has not replaced riveting yet. Rivets are still present even in newest composite aircraft AIRBUS 350. The reliability of the adhesive bonding limits the use of adhesive bonding for primary aircraft structures and there is a search for new non-destructive testing tools allowing to (1)...
Paper Details
Title
The use of electromechanical impedance conductance signatures for detection of weak adhesive bonds of carbon fibre–reinforced polymer
Published Date
May 22, 2015
Volume
14
Issue
4
Pages
332 - 344
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