Void growth in copper during high-temperature power-law creep
Abstract
Growth of grain boundary voids during high-temperature power-law creep of metals is usually approximated as the growth of a hole in a nonlinearly viscous solid. Using synchrotron tomography, we show that the functional form of the continuum law is valid but that the real growth rates in copper are higher than the prediction of the viscous model by a factor of about 40. Submicrometer resolution tomography showing faceted void shapes as well as...
Paper Details
Title
Void growth in copper during high-temperature power-law creep
Published Date
Jan 1, 2011
Journal
Volume
59
Issue
2
Pages
671 - 677
Citation AnalysisPro
You’ll need to upgrade your plan to Pro
Looking to understand the true influence of a researcher’s work across journals & affiliations?
- Scinapse’s Top 10 Citation Journals & Affiliations graph reveals the quality and authenticity of citations received by a paper.
- Discover whether citations have been inflated due to self-citations, or if citations include institutional bias.
Notes
History