Investigation on lead-free solder joint reliability of edge-bonded CBGA under temperature cycling
Pages: 1 - 6
Published: Nov 3, 2011
Abstract
The use of edge-bond adhesive is recently found to be a possible alternative to underfill for solder joint protection. This paper investigates the effectiveness of using it for the enhancement of solder joint thermal fatigue reliability. Both the accelerated temperature cycling (ATC) test and simulation are performed for the study. The test vehicle is a 51×51 mm ceramic ball grid array (CBGA) package. There are three batches of samples prepared....
Paper Details
Title
Investigation on lead-free solder joint reliability of edge-bonded CBGA under temperature cycling
Published Date
Nov 3, 2011
Pages
1 - 6
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