Reversible “Wetting” of grain boundaries by the second solid phase in the Cu-In system

The reversible wetting of grain boundaries by the second solid phase in the copper-indium system has been observed. With an increase in the temperature, the contact angle θ between the (Cu)/(Cu) grain boundary in a Cu-based solid solution based and particles of the δ-phase (Cu70In30) decreases gradually. Above T null null null null null null null null null null null null null null null W = 370°C, the first (Cu)/(Cu) grain boundaries completely...