Experimental Observation of Correlation Between Creep and Uniaxial Ratchetting of Sn∕37Pb and Sn∕3Ag∕0.5Cu Solder Alloys

Time-dependent deformations such as creep and ratchetting of solder alloys are significant deformation phenomena that need to be understood to ensure the safety and reliability of solder joints in electronic packaging. There is much research on creep deformation of solder alloys, but ratchetting deformation, especially the correlation between creep and ratchetting deformation of solder alloys has not been investigated. This paper discusses the...