Time–temperature dependence of thermomechanical recovery of cold-curing structural adhesives

The thermomechanical recovery behavior of a commercial cold-curing structural epoxy adhesive was investigated. Exposing the adhesive to temperatures above the glass transition temperature Tg significantly increased the latter although the curing degree increased only marginally. Cooling the adhesive from temperatures above Tg to temperatures below Tg led to full recovery of the mechanical properties (tensile stiffness and strength). The...