Preparation and Properties of Polysiloxane Modified Epoxy Encapsulating Material
Abstract
In order to solve the poor toughness, fatigue durability and shock resistance defects of the cured epoxy resin, in this paper, the epoxy resin was modified via dichlorodiphenyl silane as a modifier. Then the electronic packaging materials were prepared using the modified EP as matrix, a nitrile rubber (CTBN) as a toughening agent, methyl nadic anhydride (MNA) as a curing agent, and 2, 4, 6 - tris (dimethyl amino methyl) phenol as a curing...
Paper Details
Title
Preparation and Properties of Polysiloxane Modified Epoxy Encapsulating Material
Published Date
Aug 1, 2014
Journal
Volume
1021
Pages
3 - 6
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